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Effect of guanidine hydrochloride(cas 50-01-1) volume fraction on polishing solution

In order to achieve the high removal rate of Ta, the volume fraction of each component in the alkaline barrier layer was changed by experiments to study the effect of the change of each component on the Cu and Ta polishing rate of the barrier material. Alkaline barrier layer polishing solution, first determine the ratio of abrasive and deionized water, and then change the guanidine hydrochloride(cas 50-01-1) and chelating agent and other components of the volume fraction, the Cu and Ta polishing rate changes, easy to select the conditions under the barrier Polishing the best ratio. The effects of the polishing solution on the 12-inch (1 inch = 2.54 cm) wiring disc pitch correction and copper wiring surface roughness were characterized by various test methods. The results show that the polishing rate of Ta and Cu is obviously the same as that of each component. When the volume fraction of abrasive is 30%, the volume fraction of guanidine hydrochloride(cas 50-01-1) is 3% and the chelating agent volume fraction is 1%, the maximum Ta and Cu Poor polishing rate. After the optimization of the new type of barrier layer polishing solution within 1 min can achieve the effective correction of the pit and the roughness of the significant reduction.



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